By Markus Graf, Diego Barrettino, Henry P. Baltes, Andreas Hierlemann
The ebook "CMOS Hotplate Chemical Microsensors" offers a entire remedy of the interdisciplinary box of CMOS technology-based chemical microsensor structures, and, particularly, of microhotplate-based platforms. The booklet is, at the one hand, detailed at scientists and engineers which are drawn to getting first insights within the box of microhotplates and comparable chemical sensing, due to the fact all worthwhile basic wisdom is incorporated. nevertheless, it additionally addresses specialists within the box because it presents designated info on all very important matters concerning understanding microhotplates and, particularly, microhotplate-based chemical sensors in CMOS technology.A huge variety of microhotplate realizations and integrated-sensor-system implementations illustrate the present state-of-the-art and, while, provide an impact of the long run strength of chemical microsensors in CMOS expertise. when you consider that microsensors produce "microsignals", sensor miniaturization with no sensor integration is, in lots of situations, liable to failure. This e-book can help to bare the advantages of utilizing built-in electronics and CMOS-technology for constructing microhotplates and the corresponding chemical microsensor platforms and, particularly, the benefits that consequence from knowing monolithically built-in sensor structures comprising transducers and linked circuitry on a unmarried chip.
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Extra resources for CMOS Hotplate Chemical Microsensors
Schematic of the process ﬂow to fabricate the circular microhotplate Local Metallization Good electrical contact to the sensitive layer is required for optimal sensor operation. The CMOS aluminum metallization turned out not to be well suited for contacting the tin-oxide droplet. Oxidation of the coated electrodes was observed during annealing. As a consequence, the contact resistance increased, and no sensor signal was measurable. To circumvent this problem, a lift-oﬀ metallization process for covering the electrodes with a better contact metal, such as platinum, was developed.
The temperature sensors (nominal resistance of kΩ) were placed in characteristic locations on the microhotplate, which were numbered T to T . The measurement results have been compared to the corresponding values of a FEM simulation in Sect. 2, and the validity of the model for simulations of the temperature distribution has been established. Instead of a silicon island underneath the dielectric layer, a polysilicon plate can be placed in the membrane center. Such a device was not fabricated, but the eﬀect of a heat spreader that is integrated in the dielectric membrane was demonstrated by simulations.